Sensors & Transducers Journal
3D integration is the key to advanced microelectronic systems. Die-to-wafer assembly is a necessary step to reach full integration. Self-assembly methods are promising due to their parallel aspect which overcomes the main difficulties of the current techniques. The aim of this work is the understanding of the mechanisms of self-alignment with an evaporating droplet technique and the investigation the stable and unstable modes. Using the Surface Evolver software, we analyze the causes for misalignments of the system and their evolution.
J. Berthier1, K. Brakke, F. Grossi, L. Sanchez, L. Di Cioccio Silicon Die Self-alignment on a Wafer: Stable and Unstable Modes, Sensors & Transducers Journal, 115(4), 135-150 (2010).